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シリコンウェハ再生 Silicon Wafer Reclaim

ドライエッチング技術 Technology of Dry Etching

シリコンウェハ再生
Technology of Silicon Wafer Reclaim(PDF)

Based on long time experience of Quarts Crystal assembly, KDK just introduced new reclaim process for 12-Inch Silicon Wafer.
This New Process used plasma equipments, which KDK originally developed for High Frequency quartz process and it had been re-innovated for Silicon Wafer Process. Silicon Wafer Reclaim process normally performed by chemical and mechanical lapping to remove surface layer, but KDK new process used plasma equipment to remove several layers by no damage and no chemical on the process. Reclaim rotations rapidly increase compare standard reclaim process.
This New Process offer New Environmental Approach for Silicon Wafer Reclaim Market.

KDKプラズマエッチングの特徴1 Plasma Etching Feature1

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KDKプラズマエッチングの特徴2 Plasma Etching Feature2

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プラズマエッチング前後 Plasma Etching Before After

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Before plasma etching
yajirusi
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After plasma etching

KDKプラズマエッチング特徴まとめ Plasma Etching Feature Summary

Our plasma etching is the silicon wafer reclaiming technology to obtain the truly reclaimed wafer surface by using our own limited-ion-damaged plasma dry processing.

プラズマエッチング装置 Plasma Etching Machine

12 inch use full automatic plasma etching machine(Made in KDK)

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Plasma etching machine(prototype)
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3 plasma chambers integrated for 12 inch use full automatic etching machine

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