Based on long time
experience of Quarts Crystal assembly, KDK just introduced new reclaim
process for 12-Inch Silicon Wafer
This New Process used plasma equipments, which KDK originally developed for
High Frequency quartz process and it had been re-innovated for Silicon Wafer
Silicon Wafer Reclaim process normally performed by chemical and mechanical
lapping to remove surface layer, but KDK new process used plasma equipment
to remove several layers by no damage and no chemical on the process.
Reclaim rotations rapidly increase compare standard reclaim process.
This New Process offer New Environmental Approach for Silicon Wafer Reclaim